Dielectric Constant

 Customizable based on material selection (e.g., FR-4: ~4.4, Rogers: ~3.5)

 Thermal Conductivity

 Enhanced with thermal vias and heat dissipation layers

 Heat Dissipation

 Optimized layout for better thermal performance

 Temperature Cycling

 Tested from -40°C to +125°C

 Humidity Sensitivity Level (MSL)

 Up to MSL 3

 Mechanical Testing

 Drop test, vibration test, etc.

 BGA (Ball Grid Array)

 Supported with fine pitch designs

 CSP (Chip Scale Package)

 Compatible with advanced packaging technologies

 QFN (Quad Flat No-leads)

 Supported for compact designs

 Additional Features

 Lightweight Design，High Reliability，Cost Efficiency