No

Item

Mass Production Capacity

Sample Capacity

1

Layers(flex)

1－18 layers

1－22 layers

2

Layers（Rigid-Flex）

2－18 layers

2－22 layers

3

Board Thickness

Min 0.05mm Max 3.0mm;

Min 0.036mm             Max 3.0mm

4

Thickness Tolerance

≤ 0.25mm ± 0.03;

Rigid-Flex：≤1.00mm±0.10;＞1.00mm±10%

＞0.25mm±0.05

5

Overall Stiffener Thickness Tolerance

≤ 0.25mm ± 0.03;

FR4 Stiffener Thickness Tolerance：≤1.00mm±0.10；＞1.00mm±10%

＞0.25mm±0.05

7

Max CNC drilling Hole Diameter

6.5mm

7.0mm

8

Min CNC drilling Hole Diameter

Flex 0.1mm Rigid-Flex 0.1mm

Flex 0.1mm          Rigid-Flex 0.1mm

9

Deviation between holes

±0.05mm

±0.05mm

10

Min CVL Drilling Hole Diameter

0.6mm

0.6mm

11

Min CVL Drilling Holes Distance

0.15mm

0.15mm

12

Max. Drill Aspect Ratio

16∶1

20∶1

13

Plating Thickness

Flex 12-22μm,Rigid-Flex 25±5μm

14

Ni Thickness (Elect Ni)

1～10μm

1～10μm

15

Ni Thickness (immersion)

1-3,2-5,3-6,7-15μm

1-3,2-5,3-6,7-15μm

16

palladium (Pd) Thickness (immersion)

0.05-0.1μm

Measurement Position: Mark point or similar size pads

17

Gold thickness（immersion）

0.01-0.03um

0.025-0.05μm,

0.05-0.08μm

19

Thickness Gold thickness（immersion）

0.05-1.0μm

20

Tin Thikness

5-15um

21

Min Trace and Space

0.075/0.075mm（copper thicknes 1/3OZ）

22

Min Pad size

φ0.2mm

23

Final Trace Tolerance

±20%

±0.02mm

24

Layer To Layer Registration Tolerance

±0.1mm(Array 250*300mm)

26

Coverlay Registration Tolerance

±0.15mm

±0.1mm

27

Max Punching Size

φ2.5mm

28

Min Punching Size

φ2.0mm

29

Max Punching Thickness

0.4mm

31

Soldermask Registration

±0.2mm

33

Min Soldermask Dam

0.1mm

34

Min Distance between Ledgend to Pad

0.2mm

36

Min Outline Tolerance (between edge and line center)

±0.1mm

0.075mm（Fine punching Mould）

40

Rounting Tolerance

±0.15mm

41

Stiffener Registraion

±0.30mm

42

Layers(flex)

1－18 layers

1－22 layers

43

Layers（Rigid-Flex）

2－18 layers

2－22 layers

44

Board Thickness

Min 0.05mm Max 3.0mm;

Min 0.036mm             Max 3.0mm

45

Thickness Tolerance

≤ 0.25mm ± 0.03;

Rigid-Flex：≤1.00mm±0.10;＞1.00mm±10%

46

＞0.25mm±0.05

47

Overall Stiffener Thickness Tolerance

≤ 0.25mm ± 0.03;

FR4 Stiffener Thickness Tolerance：≤1.00mm±0.10；＞1.00mm±10%

＞0.25mm±0.05

48

Max CNC drilling Hole Diameter

6.5mm

7.0mm

49

Min CNC drilling Hole Diameter

Flex 0.1mm Rigid-Flex 0.1mm

Flex 0.1mm          Rigid-Flex 0.1mm

50

Max. Drill Aspect Ratio

16∶1

20∶1

51

Plating Thickness

Flex 12-22μm,Rigid-Flex 25±5μm

52

Min Trace and Space

0.075/0.075mm（copper thickness 1/3OZ）

53

Min Pad size

φ0.2mm

φ0.2mm

54

Final Trace Tolerance

±20%

±0.02mm

55

Layer To Layer Registration Tolerance

±0.1mm(Array 250*300mm)

±0.1mm(Array 250*300mm)

56

Coverlay Registration Tolerance

±0.15mm

±0.1mm

57

Soldermask Registration

±0.2mm

±0.2mm

58

Min Soldermask Dam

0.1mm

0.1mm

59

Min Distance between Ledgend to Pad

0.2mm

0.2mm

60

Min Outline Tolerance (between edge and line center)

±0.1mm

0.075mm（Fine punching Mould）

61

Rounting Tolerance

±0.15mm

±0.15mm

62

Stiffener Registraion

±0.30mm

±0.30mm

No

TECHNOLOGY  CAPABILITIES

2015-2016

1

Layer Count[MAX]

40

2

Min.Inner Layer Trace/Space

3 mil/3 mil

3

Min.Outer Layer Trace/Space

3 mil/3 mil

4

Max.Inner Layer Copper Thickness

6 OZ

5

Max.Outer Layer Copper Thickness

10 OZ

6

Layer To Layer Registration Tolerance

＜10L

±0.1mm

7

≥10L

±0.125mm

8

Max.Finished Board Thickness

7.0 mm

9

Min.Finished Board Thickness

0.4mm

10

Min.Core Dielectric Thickness

0.075mm

11

Min.Impedance-Single

±10%

12

Min.Impedance-Differential

±10%

13

HDI Stack Up

2+N+2

14

Controlled Depth Drilling Tolerance

±0.1mm

15

Max Production Panel Size

23"*35"

16

Via In PAD      PAD

YES

17

Min BGA Pitch(with trace) BGA

0.5mm

18

Soldermask Registration

±0.038mm

19

Min.Solder Dam

0.089mm

20

Min.Drilled Hole Size-Mechanical

0.15mm

21

Min.Drilled Hole Size-Laser

0.1mm

22

Max.Mechanical Drill Aspect Ratio

20:01

23

Max.Laser Drill Aspect Ratio

0.8:1

24

MIN Press Fit Hole

±0.08mm

25

Layer Count[MAX]

40

26

Min.Inner Layer Trace/Space

3 mil/3 mil

27

Min.Outer Layer Trace/Space

3 mil/3 mil

28

Max.Inner Layer Copper Thickness

6 OZ

29

Max.Outer Layer Copper Thickness

10 OZ

30

Max.Finished Board Thickness

7.0 mm

31

Min.Finished Board Thickness

0.4mm

32

Min.Core Dielectric Thickness

0.075mm

33

HDI Stack Up

2+N+2

34

Max Production Panel Size

23"*35"

35

Min BGA Pitch(with trace) BGA

0.5mm

36

Soldermask Registration

±0.038mm

37

Min.Solder Dam

0.089mm

38

Min.Drilled Hole Size-Mechanical

0.15mm

39

Min.Drilled Hole Size-Laser

0.1mm

40

Max.Mechanical Drill Aspect Ratio

20:01

No

Items

Description

1

Layers

1-4 layer

2

Material Supplier

Bergquist,Laird,SANYO,Polytronics,

TOTKING,DENKA,NRK,KW-ALG,EASTPOWER

3

Metal Type

Aluminum base,Copper base

4

Thickness

0.4-3.2mm
Aluminum Thickness： 0.4mm，0.5mm，0.6mm，0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm

5

Dielectric Thickness

50-200um

6

Board Thickness Tolorence

±0.1mm

7

Max Board Size

703mm × 550mm

8

Thermal conductivity

1W/mK、2W/mK

9

VDC (Based on min line to edge)

0.3mm：VDC 600V/50UA
0.5mm：VDC 1000V/50UA
1.0mm：VDC 1500V/50UA

10

Min Core Thickness

0.1mm

11

Min inner Line/Space

0.1/0.1mm

12

Max inner Line/Space

0.1/0.1mm

13

Registration Tolerance between layers

±0.05mm

14

Copper Thickness

HOZ,1OZ,2OZ,4OZ

15

Min Final Hole Size

0.55mm（≥3/4 board thickness）

16

Min Final Hole Tolerance(NPTH)

±0.05mm

17

Tolerance of Hole Position(based on CAD data)

±0.075mm

18

Aspecct Ratio

8:01

19

V-Cut Angle

30°、45°、60°

20

V-Cut Board Thickness Range

0.5-3.2mm

21

Tolerance of Outline

±0.10mm (4mil)

22

Max Punching Board Thickness

2.0mm

1

Max Stencil Size

1560mm*450mm

2

Min SMT Package

0201

3

Min IC Pitch

0.3mm

4

Max PCB Size

1200mm*400mm

5

Min PCB Thinkness

0.35mm

6

Min Chip Size

01 005

7

Max BGA Size

74mm*74mm

8

BGA Ball Pitch

1.0-3.00

9

BGA Ball Diameter

0.2 - 1.0mm

10

QFP Lead Pitch

0.2mm-2.54mm

11

SMT Capacity

2 million points per day