1

Layers(flex)

1－18 layers

2

Layers（Rigid-Flex）

2－18 layers

3

Board Thickness

Min 0.05mm Max 3.0mm;

4

Thickness Tolerance

＞0.25mm±0.05

5

Thickness Tolerance

≤ 0.25mm ± 0.03;

6

Overall Stiffener Thickness Tolerance

＞0.25mm±0.05

7

Overall Stiffener Thickness Tolerance

≤ 0.25mm ± 0.03

8

Max CNC drilling Hole Diameter

6.5mm

9

Min CNC drilling Hole Diameter

Flex 0.1mm Rigid-Flex 0.1mm

10

Max. Drill Aspect Ratio

16∶1

11

Plating Thickness

Flex 12-22μm,Rigid-Flex 25±5μm

12

Min Trace and Space

0.075/0.075mm（copper thickness 1/3OZ）

13

Min Pad size

φ0.2mm

14

Final Trace Tolerance

±20%

15

Layer To Layer Registration Tolerance

±0.1mm(Array 250*300mm)

16

Coverlay Registration Tolerance

±0.15mm

17

Soldermask Registration

±0.2mm

18

Min Soldermask Dam

0.1mm

19

Min Distance between Ledgend to Pad

0.2mm

20

Min Outline Tolerance (between edge and line center)

±0.1mm

21

Rounting Tolerance

±0.15mm

22

Stiffener Registraion

±0.30mm

23

Layers(flex)

1－18 layers

24

Layers（Rigid-Flex）

2－18 layers

25

Board Thickness

Min 0.05mm Max 3.0mm;

26

Thickness Tolerance

＞0.25mm±0.05

27

Thickness Tolerance

≤ 0.25mm ± 0.03;

28

Overall Stiffener Thickness Tolerance

＞0.25mm±0.05

29

Overall Stiffener Thickness Tolerance

≤ 0.25mm ± 0.03;

30

Max CNC drilling Hole Diameter

6.5mm

31

Min CNC drilling Hole Diameter

Flex 0.1mm Rigid-Flex 0.1mm

32

Deviation between holes

±0.05mm

33

Min CVL Drilling Hole Diameter

0.6mm

34

Min CVL Drilling Holes Distance

0.15mm

35

Max. Drill Aspect Ratio

16∶1

36

Plating Thickness

Flex 12-22μm,Rigid-Flex 25±5μm

37

Ni Thickness (Elect Ni)

1～10μm

38

Ni Thickness (immersion)

1-3,2-5,3-6,7-15μm

39

palladium (Pd) Thickness (immersion)

0.05-0.1μm

40

Gold thickness（immersion）

0.01-0.03um

41

Gold thickness（immersion）

0.025-0.05μm,

42

Gold thickness（immersion）

0.05-0.08μm

43

Thickness Gold thickness（immersion）

0.05-1.0μm

44

Tin Thikness

5-15um

45

Min Trace and Space

0.075/0.075mm（copper thicknes 1/3OZ）

46

Min Pad size

φ0.2mm

47

Final Trace Tolerance

±20%

48

Layer To Layer Registration Tolerance

±0.1mm(Array 250*300mm)

49

Coverlay Registration Tolerance

±0.15mm

50

Max Punching Size

φ2.5mm

51

Min Punching Size

φ2.0mm

52

Max Punching Thickness

0.4mm

53

Soldermask Registration

±0.2mm

54

Min Soldermask Dam

0.1mm

55

Min Distance between Ledgend to Pad

0.2mm

56

Min Outline Tolerance (between edge and line center)

±0.1mm

57

Rounting Tolerance

±0.15mm

58

Stiffener Registraion

±0.30mm

59

TECHNOLOGY CAPABILITIES

2024

60

Layer Count[MAX]

40

61

Min.Inner Layer Trace/Space

3 mil/3 mil

62

Min.Outer Layer Trace/Space

3 mil/3 mil

63

Max.Inner Layer Copper Thickness

6 OZ

64

Max.Outer Layer Copper Thickness

10 OZ

65

Layer To Layer Registration Tolerance ≥10L

±0.125mm

66

Layer To Layer Registration Tolerance ＜10L

±0.1mm

67

Max.Finished Board Thickness

7.0 mm

68

Min.Finished Board Thickness

0.4mm

69

Min.Core Dielectric Thickness

0.075mm

70

Min.Impedance-Single

±10%

71

Min.Impedance-Differential

±10%

72

HDI Stack Up

Anylayer HDI

73

Controlled Depth Drilling Tolerance

±0.1mm

74

Max Production Panel Size

23"*35"

75

Via In PAD

0.5mm

76

Via In PAD

YES

77

Min BGA Pitch(with trace) BGA

0.5mm

78

Soldermask Registration

±0.038mm

79

Min.Solder Dam

0.089mm

80

Min.Drilled Hole Size-Mechanical

0.15mm

81

Min.Drilled Hole Size-Laser

0.1mm

82

Max.Mechanical Drill Aspect Ratio

20:01

83

Max.Laser Drill Aspect Ratio

0.8:1

84

MIN Press Fit Hole

±0.08mm

85

Layers

1-4 layer

86

Material Supplier

TOTKING,DENKA,NRK,KW-ALG,EASTPOWER

87

Material Supplier

Bergquist,Laird,SANYO,Polytronics,

88

Metal Type

Aluminum base,Copper base

89

Aluminum Thickness

0.4mm，0.5mm，0.6mm，0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm

90

Thickness

0.4-3.2mm

91

Dielectric Thickness

50-200um

92

Board Thickness Tolorence

±0.1mm

93

Max Board Size

703mm × 550mm

94

Thermal conductivity

1W/mK、2W/mK

95

VDC (Based on min line to edge)

1.0mm：VDC 1500V/50UA

96

VDC (Based on min line to edge)

0.5mm：VDC 1000V/50UA

97

VDC (Based on min line to edge)

0.3mm：VDC 600V/50UA

98

Min Core Thickness

0.1mm

99

Min inner Line/Space

0.1/0.1mm

100

Max inner Line/Space

0.1/0.1mm

1

Layers

1-4 layer

2

Material Supplier

TOTKING,DENKA,NRK,KW-ALG,EASTPOWER

3

Material Supplier

Bergquist,Laird,SANYO,Polytronics,

4

Metal Type

Aluminum base,Copper base

5

Aluminum Thickness

0.4mm，0.5mm，0.6mm，0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm

6

Thickness

0.4-3.2mm

7

Dielectric Thickness

50-200um

8

Board Thickness Tolorence

±0.1mm

9

Max Board Size

703mm × 550mm

10

Thermal conductivity

1W/mK、2W/mK

11

VDC (Based on min line to edge)

1.0mm：VDC 1500V/50UA

12

VDC (Based on min line to edge)

0.5mm：VDC 1000V/50UA

13

VDC (Based on min line to edge)

0.3mm：VDC 600V/50UA

14

Min Core Thickness

0.1mm

15

Min inner Line/Space

0.1/0.1mm

16

Max inner Line/Space

0.1/0.1mm

17

Registration Tolerance between layers

±0.05mm

18

Copper Thickness

HOZ,1OZ,2OZ,4OZ

19

Min Final Hole Size

0.55mm（≥3/4 board thickness）

20

Min Final Hole Tolerance(NPTH)

±0.05mm

21

Tolerance of Hole Position(based on CAD data)

±0.075mm

22

Aspecct Ratio

8:01:00

23

V-Cut Angle

30°、45°、60°

24

V-Cut Board Thickness Range

0.5-3.2mm

25

Tolerance of Outline

±0.10mm (4mil)

26

Max Punching Board Thickness

2.0mm

1

Layers(flex)

1－18 layers

1－22 layers

2

Layers（Rigid-Flex）

2－18 layers

2－22 layers

3

Board Thickness

Min 0.05mm Max 3.0mm;

Min 0.036mm Max 3.0mm

4

Thickness Tolerance

＞0.25mm±0.05

Rigid-Flex：≤1.00mm±0.10;＞1.00mm±10%

5

Thickness Tolerance

≤ 0.25mm ± 0.03;

Rigid-Flex：≤1.00mm±0.10;＞1.00mm±10%

6

Overall Stiffener Thickness Tolerance

＞0.25mm±0.05

FR4 Stiffener Thickness Tolerance：≤1.00mm±0.10；＞1.00mm±10%

7

Overall Stiffener Thickness Tolerance

≤ 0.25mm ± 0.03;

FR4 Stiffener Thickness Tolerance：≤1.00mm±0.10；＞1.00mm±10%

8

Max CNC drilling Hole Diameter

6.5mm

7.0mm

9

Min CNC drilling Hole Diameter

Flex 0.1mm Rigid-Flex 0.1mm

Flex 0.1mm Rigid-Flex 0.1mm

10

Deviation between holes

±0.05mm

±0.05mm

11

Min CVL Drilling Hole Diameter

0.6mm

0.6mm

12

Min CVL Drilling Holes Distance

0.15mm

0.15mm

13

Max. Drill Aspect Ratio

16∶1

20∶1

14

Plating Thickness

Flex 12-22μm,Rigid-Flex 25±5μm

15

Ni Thickness (Elect Ni)

1～10μm

1～10μm

16

Ni Thickness (immersion)

1-3,2-5,3-6,7-15μm

1-3,2-5,3-6,7-15μm

17

palladium (Pd) Thickness (immersion)

0.05-0.1μm

Measurement Position: Mark point or similar size pads

18

Gold thickness（immersion）

0.01-0.03um

Measurement Position: Mark point or similar size pads

19

Gold thickness（immersion）

0.025-0.05μm,

Measurement Position: Mark point or similar size pads

20

Gold thickness（immersion）

0.05-0.08μm

Measurement Position: Mark point or similar size pads

21

Thickness Gold thickness（immersion）

0.05-1.0μm

Measurement Position: Mark point or similar size pads

22

Tin Thikness

5-15um

Measurement Position: Mark point or similar size pads

23

Min Trace and Space

0.075/0.075mm（copper thicknes 1/3OZ）

24

Min Pad size

φ0.2mm

25

Final Trace Tolerance

±20%

±0.02mm

26

Layer To Layer Registration Tolerance

±0.1mm(Array 250*300mm)

27

Coverlay Registration Tolerance

±0.15mm

±0.1mm

28

Max Punching Size

φ2.5mm

29

Min Punching Size

φ2.0mm

30

Max Punching Thickness

0.4mm

31

Soldermask Registration

±0.2mm

32

Min Soldermask Dam

0.1mm

33

Min Distance between Ledgend to Pad

0.2mm

34

Min Outline Tolerance (between edge and line center)

±0.1mm

0.075mm（Fine punching Mould）

35

Rounting Tolerance

±0.15mm

36

Stiffener Registraion

±0.30mm

1

Layers(flex)

1－18 layers

1－22 layers

2

Layers（Rigid-Flex）

2－18 layers

2－22 layers

3

Board Thickness

Min 0.05mm Max 3.0mm;

Min 0.036mm Max 3.0mm

4

Thickness Tolerance

＞0.25mm±0.05

Rigid-Flex：≤1.00mm±0.10;＞1.00mm±10%

5

Thickness Tolerance

≤ 0.25mm ± 0.03;

Rigid-Flex：≤1.00mm±0.10;＞1.00mm±10%

6

Overall Stiffener Thickness Tolerance

＞0.25mm±0.05

FR4 Stiffener Thickness Tolerance：≤1.00mm±0.10；＞1.00mm±10%

7

Overall Stiffener Thickness Tolerance

≤ 0.25mm ± 0.03

FR4 Stiffener Thickness Tolerance：≤1.00mm±0.10；＞1.00mm±10%

8

Max CNC drilling Hole Diameter

6.5mm

7.0mm

9

Min CNC drilling Hole Diameter

Flex 0.1mm Rigid-Flex 0.1mm

Flex 0.1mm Rigid-Flex 0.1mm

10

Max. Drill Aspect Ratio

16∶1

20∶1

11

Plating Thickness

Flex 12-22μm,Rigid-Flex 25±5μm

12

Min Trace and Space

0.075/0.075mm（copper thickness 1/3OZ）

13

Min Pad size

φ0.2mm

φ0.2mm

14

Final Trace Tolerance

±20%

±0.02mm

15

Layer To Layer Registration Tolerance

±0.1mm(Array 250*300mm)

±0.1mm(Array 250*300mm)

16

Coverlay Registration Tolerance

±0.15mm

±0.1mm

17

Soldermask Registration

±0.2mm

±0.2mm

18

Min Soldermask Dam

0.1mm

0.1mm

19

Min Distance between Ledgend to Pad

0.2mm

0.2mm

20

Min Outline Tolerance (between edge and line center)

±0.1mm

0.075mm（Fine punching Mould）

21

Rounting Tolerance

±0.15mm

±0.15mm

22

Stiffener Registraion

±0.30mm

±0.30mm

1

TECHNOLOGY CAPABILITIES

2024

2

Layer Count[MAX]

40

3

Min.Inner Layer Trace/Space

3 mil/3 mil

4

Min.Outer Layer Trace/Space

3 mil/3 mil

5

Max.Inner Layer Copper Thickness

6 OZ

6

Max.Outer Layer Copper Thickness

10 OZ

7

Layer To Layer Registration Tolerance ≥10L

±0.125mm

8

Layer To Layer Registration Tolerance ＜10L

±0.1mm

9

Max.Finished Board Thickness

7.0 mm

10

Min.Finished Board Thickness

0.4mm

11

Min.Core Dielectric Thickness

0.075mm

12

Min.Impedance-Single

±10%

13

Min.Impedance-Differential

±10%

14

HDI Stack Up

Anylayer HDI

15

Controlled Depth Drilling Tolerance

±0.1mm

16

Max Production Panel Size

23"*35"

17

Via In PAD

0.5mm

18

Via In PAD

YES

19

Min BGA Pitch(with trace) BGA

0.5mm

20

Soldermask Registration

±0.038mm

21

Min.Solder Dam

0.089mm

22

Min.Drilled Hole Size-Mechanical

0.15mm

23

Min.Drilled Hole Size-Laser

0.1mm

24

Max.Mechanical Drill Aspect Ratio

20:01

25

Max.Laser Drill Aspect Ratio

0.8:1

26

MIN Press Fit Hole

±0.08mm